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Product Incazelo
The HJ30J Series Micro Rectangular High-Speed Connectors are designed for high-density, high-speed board-to-board interconnections in chassis and cabinet-level applications, offering excellent electrical performance and mechanical reliability in harsh environments.
Izici Key
- Flexible stranded pin contacts for enhanced reliability
- High-density contact layout with 1.27 mm × 1.27 mm pitch
- Metal shielding shell for superior EMI protection
- Available in 7 shell sizes: 12, 18, 24, 30, 36, 55, 100 contacts
- Ideal for high-speed signal transmission between boards
Imininingwane Technical
| Ipharamitha | Ukucaciswa |
| izinga lokushisa lokusebenza | –55 ° C kuye ku- + 125 ° C |
| I-impedance yesici | 100 ±15 Ω |
| Kukalwe njengamanje | 3 A |
| Ukuphikiswa kokuxhumana | ≤ 20 mΩ |
| I-Dielectric ukumelana ne-voltage | 800 V (izinga lokushisa legumbi) |
| Ukumelana nokuqina | ≥ 5000 MΩ (500 VDC); ≥ 100 MΩ (wet heat) |
| Izinga lokudluliswa kwedatha | Kufika kuma-1.65 Gbps |
| Impilo yemishini | 500 imijikelezo yokukhwelana |
| Vibration | 10–2000 Hz, 196 m/s² |
| Shock | 735 m / s² |
